TE Connectivity 1544426-2

Product Overview

This Single-In-Line (SIL) leadframe features a 1.27 mm [.05 in] centerline and is plated with Tin over Nickel. Designed for board mounting, it utilizes a through-hole solder termination method to the PCB and accepts a PCB thickness of .63 mm [.025 in]. The leadframe has a hold-down feature without a standoff and a height of 1 mm [.039 in].

Product Attributes

• Brand: TE Connectivity
• Leadframe Type: Single-In-Line (SIL)
• Leadframe Plating Material: Tin over Nickel
• Contact Base Material: Phosphor Bronze
• EU RoHS Compliance: Compliant
• EU ELV Compliance: Compliant
• China RoHS 2 Directive: MIIT Order No 32, 2016
• Halogen Content: Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
• Solder Process Capability: Wave solder capable to 265C

Technical Specifications