PANASONIC AXK5F80337YG

Notes on Using Narrow Pitch Connectors

Observe safety remarks to prevent accidents and injuries. Do not use these connectors beyond the specification sheets. Usage outside of specified rated current, dielectric strength, and environmental conditions may cause circuitry damage via abnormal heating, smoke, and fire. Thorough specification review is appreciated; contact sales representatives if usage is out of specifications. Panasonic Corporation cannot guarantee quality and reliability for out-of-spec usage.

Electrical components and devices generally cause failures at a given statistical probability, and their durability varies with use environments or conditions. Check actual electrical components and devices under actual conditions before use. Continued usage in a degraded state may result in abnormal heat, smoke, or firing. Implement safety designs and periodic maintenance, including redundancy design, fire spread prevention, and malfunction prevention, to avoid accidents resulting in injury or death, fire accidents, or social damage.

Regarding the design of devices and PC board patterns

• When using board-to-board connectors, a pair of boards shall NOT be connected with multiple connectors to avoid mating failure or product breakage.
• Design PC boards and patterns considering the performance and abilities of mounting equipment, which may have up to a 0.2 to 0.3 mm error in positioning.
• If connectors have tabs for positioning, ensure PC boards are designed with matching positioning holes.
• To ensure mechanical strength during soldering, PC boards must meet recommended pattern design dimensions.
• Control the thicknesses of the cover lay and adhesive to prevent poor soldering, as connectors have no stand-off. Minimize cover lay thickness.
• For all narrow pitch series connectors, design means to fix the PC board in place to prevent it from coming off during vibrations or impacts and to prevent loads from falling directly on soldered portions. Example: Secure with screws using spacers.
• When connecting PC boards, take appropriate measures to prevent the connector from coming off.

When mounting connectors on an FPC

• Solder detachment may occur by force to the terminals when the connector soldered to FPC is mated or unmated. Connector handling is recommended with a reinforcing plate attached to the backside of FPC where the connector is mounted. The reinforcing plate should be larger than the "Recommended PC board pattern" (extended dimension of one side is approximately 0.5 to 1.0 mm). Materials and thickness: glass epoxy or polyimide (0.2 to 0.3 mm) or SUS (0.1 to 0.2 mm).
• As this connector has a temporary locking structure, mating may be separated by dropping impact depending on the FPC's size, weight, or bending force. Consider measures to prevent mating separation.
• The narrow pitch connector series is designed to be compact and thin. Take care when mating connectors, as displacement or angled mating could damage or deform the connector.

Regarding the selection of the connector placement machine and the mounting procedures

• Select the placement machine considering connector height, required positioning accuracy, and packaging conditions.
• Be aware that excessive chucking force may deform the connector body or terminals.
• External forces applied to contact surfaces and terminals during mounting can cause deformations.
• For larger connectors, self-alignment may not be possible. Carefully position the terminal with the PC board pattern.

Regarding soldering

Reflow soldering

• Measure recommended profile temperature by placing a sensor on the PC board near the connector surface or terminals.
• Screen printing is recommended for cream solder printing. Refer to recommended PC board patterns and metal mask window sizes for screen opening area and PC board foot pattern area. Do not increase the size of the board pattern and metal mask at the base of the terminals.
• Pay attention not to provide too much solder, as it can cause miss mating due to interference at the soldering portion.
• When mounting on both sides of the PC board and the connector is on the underside, use adhesives or other means to ensure the connector is properly fixed.
• Solder and flux characteristics vary; consider them when setting reflow temperature and oxygen level.
• Positioning bosses provide approximate alignment. Use an automatic positioning machine for accurate positioning.
• In dry conditions, static electricity may cause the product to adhere to the carrier tape. Recommended humidity is 40-60% RH. Use an ionizer to remove static electricity.
• Do not use resin-containing solder, as it may firmly fix the contacts.

Soldering conditions (Reflow)

Use the recommended reflow temperature profile. Contact sales representative before using a temperature profile other than described (e.g., lead-free solder).

• The temperature profiles are measured using the connector on a resin-based PC board. When reflow soldering on a metal board or metal table for FPC mounting, ensure no deformation or discoloration of the connector.
• Contact sales representative for screen-printing thickness other than recommended.

Hand soldering

• Set soldering iron tip temperature less than specified in Table A.
• Do not allow flux to spread onto connector leads or PC board.
• Touch the soldering iron to the foot pattern. After heating the foot pattern and terminal, apply solder wire to melt at the end of the connector terminals.
• Avoid soldering while applying a load on connector terminals.
• Thoroughly clean the soldering iron.
• After soldering, carefully check and clean contact surfaces for any solder.
• For low-profile connectors, avoid supplying too much solder to prevent miss mating.

Solder reworking

• Finish reworking in one operation.
• Do not use supplementary solder flux for rework of bridges, as it may cause contact problems.
• Keep soldering iron tip temperature below the temperature given in Table A.

Handling single components

• Do not drop or allow parts to fall.
• Excessive force on terminals can cause warping, coming out, or weaken solder adhesive strength. Handle with care.

Precautions for mating

• Prevent deformation or damage of contacts and molding by mating connectors correctly.
• Avoid reverse insertion of connectors, as it may cause circuitry damage.

Cleaning flux from PC board

• No need to clean this product. If cleaning, pay attention to the following:
• Do not insert or remove the connector when it is not soldered.
• Keep cleaning solvent clean and prevent contamination of connector contacts.
• Pure water passed liquid solvent is recommended, as some solvents may dissolve molded parts.