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Contact Plating : Tin
Mounting Type : Through Hole
Y-Width of Bottom Edge on Board : 11.2mm
Number of PINs Per Row : 2
Voltage Rating (Max) : 600V
Delivery Time : 1 working day
Number of Rows : 1
Brand Name : B02P-VL
Pins Structure : 1x2P
Operating Temperature : -25℃~+90℃
Pitch : 6.2mm
X-Length of Bottom Edge on Board (Spacing Line) : 13.4mm
Z-Height of the Board : 16.4mm
Contact Material : Copper alloy;PA66
Model Number : B02P-VL
Description : Connector Header 2 position 6.2mm Pitch 20A Through Hole -25℃~+90℃
Reference Series : VL
MOQ : 1
Packaging Details : Through Hole,P=6.2mm
Stock : 3877
Flame Retardant Rating : UL94V-0
6.2mm pitch / Disconnectable Crimp style connectors (Combined use for both wire-to-board and wire-to-wire connections)
The VL connector is designed for wire-to-wire and wire-to-board 6.2 mm pitch connections, corresponding to large current applications. A secondary retainer prevents insufficient insertion of contacts and disengagement, ensuring secure and safe connections for high-current circuits.
JST
UL Recognized E60389, LR20812, R9351103
Compliant
| Specification | Value |
|---|---|
| Current rating | 20 A AC, DC (Refer to table) |
| Voltage rating | 600 V AC, DC |
| Temperature range | -25C to +90C (including temperature rise) |
| Contact resistance (Initial) | 7 m max. |
| Contact resistance (After environmental tests) | 10 m max. |
| Insulation resistance | 1,000 M min. |
| Withstanding voltage | 2,000 VAC/minute |
| Applicable wire | AWG #22 to #12 |
| Applicable PC board thickness | 1.6 mm |
| Circuits | Wire size (AWG) #12 | Wire size (AWG) #14 | Wire size (AWG) #18 | Wire size (AWG) #20 | Wire size (AWG) #22 |
|---|---|---|---|---|---|
| 2 | 20 A | 15 A | 10 A | 8 A | 4 A |
| 3 | 17 A | 14 A | 9 A | 8 A | 4 A |
| 4 | 16 A | 13 A | 9 A | 7 A | 4 A |
| 6 | 15 A | 12 A | 8 A | 7 A | 3 A |
| 8 | 14 A | 11 A | 7 A | 6 A | 3 A |
| 12 | 13 A | 10 A | 7 A | 6 A | 3 A |
| Model No. | Applicable wire (mm) | AWG | Insulation O.D. (mm) | Qty/reel |
|---|---|---|---|---|
| SVF-42T-P2.0 | 0.3~1.25 | 22~16 | 1.7~3.2 | 2,000 |
| SVF-61T-P2.0 | 0.5~2.0 | 20~14 | 1.9~3.4 | 2,000 |
| SVF-81T-P2.0 | 0.5~3.5 | 20~12 | 2.0~4.1 | 2,000 |
| Circuits | Model No. | Qty/bag | Material |
|---|---|---|---|
| 2 | VLP-02V | 500 | PA 66, UL94V-0, natural (white) |
| 3 | VLP-03V | 500 | PA 66, UL94V-0, natural (white) |
| 4 | VLP-04V | 500 | PA 66, UL94V-0, natural (white) |
| 6 | VLP-06V | 500 | PA 66, UL94V-0, natural (white) |
| 8 | VLP-08V | 200 | PA 66, UL94V-0, natural (white) |
| 12 | VLP-12V | 100 | PA 66, UL94V-0, natural (white) |
| Circuits | Model No. | Qty/bag | Material |
|---|---|---|---|
| 2 | VLS-02V | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| 3 | VLS-03V | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| 4 (single-row), 8 | VLS-08V | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| 12 | VLS-12V | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| Circuits | Model No. | A (mm) | B (mm) | Qty/box | Material |
|---|---|---|---|---|---|
| 2 | B02P-VL | 6.2 | 13.4 | 100 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 3 | B03P-VL | 12.4 | 19.6 | 100 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 4 | B04P-VL | 6.2 | 13.4 | 100 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 4 (single-row) | B04P-VL-VN-1.8 | 18.6 | 26.2 | 100 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 6 | B06P-VL | 12.4 | 19.6 | 50 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 8 | B08P-VL | 18.6 | 26.2 | 50 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
| 12 | B12P-VL | 31.0 | 38.6 | 35 | Post: Copper-alloy, tin-plated (reflow treatment) Wafer: PA 66, UL34V-0, natural (white) |
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JST B02P-VL Images |