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JST B02P-VL

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JST B02P-VL

Contact Plating : Tin

Mounting Type : Through Hole

Y-Width of Bottom Edge on Board : 11.2mm

Number of PINs Per Row : 2

Voltage Rating (Max) : 600V

Delivery Time : 1 working day

Number of Rows : 1

Brand Name : B02P-VL

Pins Structure : 1x2P

Operating Temperature : -25℃~+90℃

Pitch : 6.2mm

X-Length of Bottom Edge on Board (Spacing Line) : 13.4mm

Z-Height of the Board : 16.4mm

Contact Material : Copper alloy;PA66

Model Number : B02P-VL

Description : Connector Header 2 position 6.2mm Pitch 20A Through Hole -25℃~+90℃

Reference Series : VL

MOQ : 1

Packaging Details : Through Hole,P=6.2mm

Stock : 3877

Flame Retardant Rating : UL94V-0

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VI-CONNECTOR

6.2mm pitch / Disconnectable Crimp style connectors (Combined use for both wire-to-board and wire-to-wire connections)

The VL connector is designed for wire-to-wire and wire-to-board 6.2 mm pitch connections, corresponding to large current applications. A secondary retainer prevents insufficient insertion of contacts and disengagement, ensuring secure and safe connections for high-current circuits.

  • Housing lances for contact retention
  • Secondary retainer
  • Suited for large current
  • Two kinds of connections

Brand

JST

Certifications

UL Recognized E60389, LR20812, R9351103

RoHS Compliance

Compliant

Specification Value
Current rating 20 A AC, DC (Refer to table)
Voltage rating 600 V AC, DC
Temperature range -25C to +90C (including temperature rise)
Contact resistance (Initial) 7 m max.
Contact resistance (After environmental tests) 10 m max.
Insulation resistance 1,000 M min.
Withstanding voltage 2,000 VAC/minute
Applicable wire AWG #22 to #12
Applicable PC board thickness 1.6 mm
Circuits Wire size (AWG) #12 Wire size (AWG) #14 Wire size (AWG) #18 Wire size (AWG) #20 Wire size (AWG) #22
2 20 A 15 A 10 A 8 A 4 A
3 17 A 14 A 9 A 8 A 4 A
4 16 A 13 A 9 A 7 A 4 A
6 15 A 12 A 8 A 7 A 3 A
8 14 A 11 A 7 A 6 A 3 A
12 13 A 10 A 7 A 6 A 3 A
Model No. Applicable wire (mm) AWG Insulation O.D. (mm) Qty/reel
SVF-42T-P2.0 0.3~1.25 22~16 1.7~3.2 2,000
SVF-61T-P2.0 0.5~2.0 20~14 1.9~3.4 2,000
SVF-81T-P2.0 0.5~3.5 20~12 2.0~4.1 2,000
Circuits Model No. Qty/bag Material
2 VLP-02V 500 PA 66, UL94V-0, natural (white)
3 VLP-03V 500 PA 66, UL94V-0, natural (white)
4 VLP-04V 500 PA 66, UL94V-0, natural (white)
6 VLP-06V 500 PA 66, UL94V-0, natural (white)
8 VLP-08V 200 PA 66, UL94V-0, natural (white)
12 VLP-12V 100 PA 66, UL94V-0, natural (white)
Circuits Model No. Qty/bag Material
2 VLS-02V 1,000 Glass-filled PA 66, UL94V-0, natural (ivory)
3 VLS-03V 1,000 Glass-filled PA 66, UL94V-0, natural (ivory)
4 (single-row), 8 VLS-08V 1,000 Glass-filled PA 66, UL94V-0, natural (ivory)
12 VLS-12V 1,000 Glass-filled PA 66, UL94V-0, natural (ivory)
Circuits Model No. A (mm) B (mm) Qty/box Material
2 B02P-VL 6.2 13.4 100 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
3 B03P-VL 12.4 19.6 100 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
4 B04P-VL 6.2 13.4 100 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
4 (single-row) B04P-VL-VN-1.8 18.6 26.2 100 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
6 B06P-VL 12.4 19.6 50 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
8 B08P-VL 18.6 26.2 50 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)
12 B12P-VL 31.0 38.6 35 Post: Copper-alloy, tin-plated (reflow treatment)
Wafer: PA 66, UL34V-0, natural (white)

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