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BXCONN WF-1E150A9P

Shenzhen ECER Network Technology Co., Ltd.
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BXCONN WF-1E150A9P

Number of PINs Per Row : 9

Pitch : 1.5mm

Delivery Time : 7-15 working days

Operating Temperature : -25℃~+85℃

Mounting Type : Surface Mount,Vertical

Model Number : WF-1E150A9P

Packaging Details : SMD,P=1.5mm

Stock : 10000

Flame Retardant Rating : UL94V-0

Contact Material : Brass;LCP

Brand Name : BXCONN

MOQ : 1000

Description : Connector Header 9 position 1.5mm Pitch 1A Surface Mount,Vertical -25℃~+85℃

Contact Plating : Tin

Voltage Rating (Max) : 100V

Reference Series : ZH

Pins Structure : 1x9P

Number of Rows : 1

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Packaging Specifications

Standardized industrial packaging solution designed for component protection during transit and storage.

Packaging Components
Desiccant, PE Waterproof Bag, Bubble Bag
Capacity
1 PCS per tray
Process
Vacuum suction positioning
ItemPackaging MaterialQuantity/UnitProcess Note
Standard PackageDesiccant, PE Bag, Bubble Bag1 PCS/TrayVacuum suction positioning

Quality BXCONN WF-1E150A9P for sale

BXCONN WF-1E150A9P Images

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