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BXCONN WF-1F100A13P

Shenzhen ECER Network Technology Co., Ltd.
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BXCONN WF-1F100A13P

Contact Plating : Tin

Description : Connector Header 13 position 1mm Pitch 1A Surface Mount, Right Angle -25℃~+85℃

Stock : 20000

MOQ : 2000

Pitch : 1mm

Operating Temperature : -25℃~+85℃

Flame Retardant Rating : UL94V-0

Pins Structure : 1x13P

Voltage Rating (Max) : 50V

Number of Rows : 1

Number of PINs Per Row : 13

Z-Height of the Board : 3.65mm

Brand Name : BXCONN

Y-Width of Bottom Edge on Board : 2.9mm

Packaging Details : SMD,P=1mm,Surface Mount,Right Angle

Model Number : WF-1F100A13P

Reference Series : SH

Contact Material : Brass;LCP

Mounting Type : Surface Mount, Right Angle

Delivery Time : 7-15 working days

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Packaging Specifications

This product utilizes a multi-layer protective packaging system designed to ensure component integrity during storage and transit.

Packaging Components
Desiccant, PE Waterproof Bag, Bubble Bag
Unit Quantity
1 PCS per tray
Packaging ItemSpecification
DesiccantStandard moisture protection
Inner ProtectionPE Waterproof Bag
Outer ProtectionBubble Bag
Unit Capacity1 PCS per tray

Quality BXCONN WF-1F100A13P for sale

BXCONN WF-1F100A13P Images

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